- I. General Papers -- Fine Particles on Semiconductor Surfaces: Sources, Removal and Impact on the Semiconductor Industry -- Cleaning Semiconductor Surfaces: Facts and Foibles -- Effect of Chemical Cleaning Sequencing on Particle Addition/Reduction on Silicon Wafers -- Measuring Aerosol Particle Concentration in Clean Rooms and Particle Areal Density on Silicon Wafer Surfaces -- Particulate Contamination on Wafer Surfaces Resulting From Hexamethyldisilazane/Water Interactions -- Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices -- Calculation of Hamaker Coefficients for Metallic Aerosols from Extensive Optical Data -- Soiling Mechanisms and Performance of Anti-Soiling Surface Coatings -- Implications of Particulate Contamination in the Performance of Floppy Disks -- II. Particle-Substrate Interaction and Particle Adhesion -- A Theoretical Review of Particle Adhesion -- The Electrostatic Force on a Dielectric Sphere Resting on a Conducting Substrate -- Electrostatic Charge Generation on Wafer Surfaces and Its Effect on Particulate Deposition -- Toner Adhesion in Electrophotography -- Adhesion and Removal of Particles: Effect of Medium -- Strong Adhesion of Dust Particles -- Prevention of Strong Adhesion of Dust Particles -- Dynamic Adhesion of Particles Impacting a Cylinder -- Crossed Fiber Models of the Particle-Surface Interaction -- Sensitive New Method for the Determination of Adhesion Force Between a Particle and a Substrate -- III. Particle Detection, Analysis and Characterization -- Detection of Particles on Clean Surfaces -- Detection of Particles Down to a “Few” Micrometers on Non-Specular Microelectronic Substrates and Other Surfaces -- Accurate Particle Counting for Bare Substrate Inspection -- Automated SEM/EDS Image Analysis of Particles on Filter Blanks -- Particle Sizing and Counting with the Inspex EX20/20 -- IV. Particle Removal -- Methods for Surface Particle Removal: A Comparative Study -- Electrostatic Removal of Particles from Surfaces -- Electric Field Detachment of Charged Particles -- A New Approach to the Removal of Sub-Micron Particles From Solid (Silicon) Substrates -- About the Contributors.
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