Materials for high-density electronic packaging and interconnection [electronic resource] : report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council

Corporate Author: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging
Published: Washington, D.C. : National Academy Press ; Alexandria, VA : Available from Defense Technical Information Center, Cameron Station, 1990.
Physical Description: xiv, 139 p. : ill. ; 28 cm.