Actions for Mold Heating and Cooling Pump Package Operator Interface Controls Upgrade [electronic resource].

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Mold Heating and Cooling Pump Package Operator Interface Controls Upgrade [electronic resource].

Published
Washington, D.C. : United States. National Nuclear Security Administration, 2009.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
21Mb : digital, PDF file
Additional Creators
Kansas City Plant (U.S.), United States. National Nuclear Security Administration, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
The modernization of the Mold Heating and Cooling Pump Package Operator Interface (MHC PP OI) consisted of upgrading the antiquated single board computer with a proprietary operating system to off-the-shelf hardware and off-the-shelf software with customizable software options. The pump package is the machine interface between a central heating and cooling system that pumps heat transfer fluid through an injection or compression mold base on a local plastic molding machine. The operator interface provides the intelligent means of controlling this pumping process. Strict temperature control of a mold allows the production of high quality parts with tight tolerances and low residual stresses. The products fabricated are used on multiple programs.
Report Numbers
E 1.99:kcp-613-8601
kcp-613-8601
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
08/07/2009.
"kcp-613-8601"
Josh A. Salmond.
Funding Information
DE-AC04-01AL66850
View MARC record | catkey: 14071164