Gas-Filled Panels [electronic resource] : An update on applications in the building thermal envelope
- Washington, D.C. : United States. Dept. of Energy, 1995. and Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- 11 pages : digital, PDF file
- Additional Creators:
- Lawrence Berkeley National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
- This paper discusses the application of Gas-Filled Panels to the building thermal envelope. Gas-Filled Panels, or GFPs, are thermal insulating devices that retain a high concentration of a low- conductivity gas, at atmospheric pressure, within a multilayer infrared reflective baffle. The thermal performance of the panel depends on the type of gas fill and the baffle configuration. Heat- flow meter apparatus measurements have shown effective apparent thermal conductivities of 0.194 Btu·in/h·ft²·°F with air as the gas fill, 0.138 Btu·in/h·ft²·°F with argon, and 0.081 Btu·in/h·ft²·°F with krypton. Calorimetric measurements have also shown total resistance levels of about R-12.6 h·ft²·°F/Btu for a 1.0-inch thick krypton panel, R-25.7 h·ft²·°F/Btu for a 2.0-inch krypton panel, and R-18.4 f·ft²·°F/Btu for a 10-inch xenon panel. GFPs are flexible, self-supporting and can be made in a variety of shapes and sizes to thoroughly fill most types of cavities in building walls and roofs, although the modular nature of the panels can lead to complications in installing them, especially for irregularly shaped cavities. We present computer simulation results showing the improvement in thermal resistance resulting from using an argon-GFP in place of glass fiber batt insulation in wood-frame construction. This report also presents estimates of the quantity and cost of material components needed to manufacture GFPs using current prototype designs.
- Published through SciTech Connect., 10/01/1995., "lbl--38093", " in--340", "conf-9511159--1", "DE96005892", BETEC fall symposium: superinsulations and the building envelope, Washington, DC (United States), 14-15 Nov 1995., and Griffith, B.T.; Arasteh, D.; Tuerler, D.
- Funding Information:
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