Double sided circuit board and a method for its manufacture [electronic resource].
- Batavia, Ill. : Fermi National Accelerator Laboratory, 1989.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Additional Creators:
- Fermi National Accelerator Laboratory
United States. Department of Energy. Office of Scientific and Technical Information
- Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths.
- Published through SciTech Connect.
Lindenmeyer, Carl W.
- Funding Information:
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