Actions for Lead zirconate titanate on base metal foils [electronic resource] : An approach for embedded high-K passive components

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Lead zirconate titanate on base metal foils [electronic resource] : An approach for embedded high-K passive components

Published
Washington, D.C. : United States. Dept. of Energy, 2000.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
7 pages : digital, PDF file
Additional Creators
Argonne National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
An approach for embedding high-K dielectric thin films into polymer packages has been developed. Pb{sub 0.85}La{sub 0.15}(Zr{sub 0.52}Ti{sub 0.48}){sub 0.96}O₃ thin films were prepared by chemical solution deposition on 50 {micro}m thick Ni-coated Cu foils. Sputter deposited Ni top electrodes completed the all base-metal capacitor stack. After high temperature N₂ crystallization anneals, the PLZT composition showed reduction resistance while the base-metal foils remained flexible. Capacitance density and Loss tangent values range between 300 and 400 nF/cm² and 0.01 and 0.02 from 1 to 1,000 kHz respectively. These properties represent a 2 to 3 order of magnitude improvement over available embedded capacitor technologies for polymeric packages.
Report Numbers
E 1.99:anl/msd/cp-100959
anl/msd/cp-100959
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
01/26/2000.
"anl/msd/cp-100959"
US-Japan Seminar on Dielectric and Piezoelectric Ceramics, Okinawa (JP), 11/03/1999--11/05/1999.
Kim, S.-H.; Dunn, G.; Streiffer, S. K.; Kingon, A. I.; Maria, J.-P.; Cheek, K.
Funding Information
W-31109-ENG-38
View MARC record | catkey: 14105801