A new mechanical characterization method for microactuators applied to shape memory films [electronic resource].

Published:: Washington, D.C : United States. Dept. of Energy. Office of the Assistant Secretary for Defense Programs, 1999.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description:: 336 Kilobytes pages : digital, PDF file
Additional Creators:: Lawrence Livermore National Laboratory, United States. Department of Energy. Office of the Assistant Secretary for Defense Programs, and United States. Department of Energy. Office of Scientific and Technical Information

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Summary:

We present a new technique for the mechanical characterization of microactuators and apply it to shape memory alloy (SMA) thin films. A test instrument was designed which utilizes a spring-loaded transducer to measure displacements with resolution of 1.5 mm and forces with resolution of 0.2 mN. Employing an out- of-plane loading method for SMA thin films, strain resolution of 30 me and stress resolution of 2.5 MPa were achieved. Four mm long, 2 {micro}m thick NiTiCu ligaments suspended across open windows were bulk micromachined for use in the out-of-plane stress and strain measurements. Static analysis showed that 63% of the applied strain was recovered while ligaments were subjected to tensile stresses of 870 MPa. This corresponds to 280 mm of actual displacement against a load of 52 mN. Fatigue analysis of the ligaments showed 33% degradation in recoverable strain (from 0.3% to 0.2%) with 2 ± 10⁴ cycles for an initial strain of 2.8%.

Report Numbers:

E 1.99:ucrl-jc-132488
ucrl-jc-132488

Subject(s):

Engineering

Other Subject(s):

Note:

Published through SciTech Connect.
03/01/1999.
"ucrl-jc-132488"
Transducers'99, The 10th International Conference on Solid-State Sensors and Actuators, Senda (JP), 06/07/1999--06/10/1999.
Ramsey, P B; Krulevitch, P; Ackler, H D; Seward, K P.

Funding Information:

W-7405-ENG-48

View MARC record | catkey: 14107121