Smart packaging for photonics [electronic resource].
- Published:
- Washington, D.C. : United States. Dept. of Energy, 1997.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy. - Physical Description:
- 57 pages : digital, PDF file
- Additional Creators:
- Sandia National Laboratories
United States. Department of Energy
United States. Department of Energy. Office of Scientific and Technical Information - Access Online:
- www.osti.gov
- Summary:
- Unlike silicon microelectronics, photonics packaging has proven to be low yield and expensive. One approach to make photonics packaging practical for low cost applications is the use of {open_quotes}smart{close_quotes} packages. {open_quotes}Smart{close_quotes} in this context means the ability of the package to actuate a mechanical change based on either a measurement taken by the package itself or by an input signal based on an external measurement. One avenue of smart photonics packaging, the use of polysilicon micromechanical devices integrated with photonic waveguides, was investigated in this research (LDRD 3505.340). The integration of optical components with polysilicon surface micromechanical actuation mechanisms shows significant promise for signal switching, fiber alignment, and optical sensing applications. The optical and stress properties of the oxides and nitrides considered for optical waveguides and how they are integrated with micromechanical devices were investigated.
- Subject(s):
- Note:
- Published through SciTech Connect.
09/01/1997.
"sand--97-2337"
"DE98000425"
Smith, J.H.; Palmer, D.W.; Sullivan, C.T.; McClellan, G.; Carson, R.F. - Funding Information:
- AC04-94AL85000
View MARC record | catkey: 14107604