Moisture and aging effects of solder wettability of copper surfaces [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 1996.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- 7 pages : digital, PDF file
- Additional Creators:
- Sandia National Laboratories
United States. Department of Energy
United States. Department of Energy. Office of Scientific and Technical Information
- Solderability is a critical property of electronic assembly that affects both manufacturing efficiency and product reliability. There is often a considerable time interval between initial fabrication of a circuit board or component and its use at the assembly level. Parts are often stored under a variety of conditions, usually not controlled. Solder wettability can soon deteriorate during storage, especially in extreme environments. This paper describes ongoing efforts at Sandia to quantify solder wettability on bare and aged Cu surfaces. In addition, organic solderability preservatives (OSPs) were applied to the bare Cu to retard solderability loss due to aging. The OSPs generally performed well, although wetting did decrease with exposure time.
- Published through SciTech Connect.
6. international workshop on moisture in microelectronics, Gaithersburg, MD (United States), 15-17 Oct 1996.
Sorensen, N.R.; Hernandez, C.L.; Lucero, S.J.
- Funding Information:
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