Multi-layer enhancement to polysilicon surface-micromachining technology [electronic resource].

Published: Washington, D.C. : United States. Dept. of Energy, 1997.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description: 5 pages : digital, PDF file
Additional Creators: Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information

Access Online

www.osti.gov

Availability

Finding items...

Restrictions on Access

Free-to-read Unrestricted online access

Summary

A multi-level polysilicon surface-micromachining technology consisting of 5 layers of polysilicon is presented. Surface topography and film mechanical stress are the major impediments encountered in the development of a multilayer surface-micromachining process. However, excellent mechanical film characteristics have been obtained through the use of chemical-mechanical polishing for planarization of topography and by proper sequencing of film deposition with thermal anneals. Examples of operating microactuators, geared power-transfer mechanisms, and optical elements demonstrate the mechanical advantages of construction with 5 polysilicon layers.

Report Numbers

E 1.99:sand--97-2349c
E 1.99: conf-971207--
conf-971207--
sand--97-2349c

Subject(s)

Other Subject(s)

Note

Published through SciTech Connect.
10/01/1997.
"sand--97-2349c"
" conf-971207--"
"DE98000241"
"DP0102022"
1997 international electron devices meeting, Washington, DC (United States), 7-10 Dec 1997.
Rodgers, M.S.; Sniegowski, J.J.

Funding Information

AC04-94AL85000

View MARC record | catkey: 14108694