Near-plastic threshold indentation and the residual stress in thin films [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 1996. and Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- 6 pages : digital, PDF file
- Additional Creators:
- Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- In recent studies, the authors used the Interfacial Force Microscope in a nanoindenter mode to survey the nanomechanical properties of Au films grown on various substrates. Quantitative tabulations of the indentation modulus and the maximum shear stress at the plastic threshold showed consistent values over individual samples but a wide variation from substrate to substrate. These values were compared with film properties such as the surface roughness, average grain size and interfacial adhesion and no correlation was found. However, in a subsequent analysis of the results, they found consistencies which support the integrity of the data and point to the fact that the results are sensitive to some property of the various film/substrate combinations. In the present paper, they discuss these consistencies and show recent measurements which strongly suggest that the property that is being probed is the residual stress in the films caused by their interaction with the substrate surfaces.
- Published through SciTech Connect., 07/01/1996., "sand--96-1743c", " conf-960401--62", "DE96012936", Spring meeting of the Materials Research Society (MRS), San Francisco, CA (United States), 8-12 Apr 1996., and Houston, J.E.; Michalske, T.A.
- Funding Information:
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