A silicon microbench concept for optoelectronic packaging [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 1996.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- 8 pages : digital, PDF file
- Additional Creators:
- Lawrence Livermore National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- Optoelectronics (o/e) is currently too expensive for widespread application. We believe that the packaging (or fiber pigtailing) process must be automated to realize a significant reduction in the cost of o.e packages. We are addressing issues of automating the fiber pigtailing process on silicon waferboards or microbenches. This paper focuses on reflowing solders for the attachment of o/e components. We have recently developed miniature polysilicon heaters which are integrated on silicon microbenches. These miniature heaters avoid the problem of raising the entire microbench to the solder melting point to attach components. Most importantly, these miniature heaters are completely compatible with automating the attachment process. Designing silicon microbenches with on-board heaters requires some care. The thermal properties of the microbench itself along with all coatings and any heatsinking materials must be understood. The heaters must operate in a current and voltage regime compatible with the overall characteristics of the o.e package. Inadvertently reflowing solder in unanticipated locations may occur unless the thermal behavior of the microbench thoroughly known. This paper describes the design and fabrication of our microbenches and an experimental and theoretical study on these silicon microbenches which gives a complete picture of their thermal behavior.
- Report Numbers:
- E 1.99:ucrl-jc--124368
E 1.99: conf-9609212--1
- Other Subject(s):
- Published through SciTech Connect.
Surface Mount International: advanced electronics manufacturing technologies, San Jose, CA (United States), 3-12 Sep 1996.
Kerns, J.A.; Pocha, M.D.; Strand, O.T.
- Funding Information:
View MARC record | catkey: 14109373