Low-power modular parallel photonic data links [electronic resource].
- Published
- Washington, D.C. : United States. Dept. of Energy, 1996.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy. - Physical Description
- 6 pages : digital, PDF file
- Additional Creators
- Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
Access Online
- Restrictions on Access
- Free-to-read Unrestricted online access
- Summary
- Many of the potential applications for parallel photonic data links could benefit from a bi-directional Optoelectronic Multi-Chip Module (OEMCM), where the optical transmitter, receiver, and first-level interface electronics are combined into a single package. It would be desirable for such a module to exhibit low power consumption, have a simple electronic interface that can operate at a variety of speeds, and possess a capability to use interchangeable optics for a variety of external connections. Here, we describe initial results for a parallel photonic link technology that exhibits those properties. This link uses high-efficiency, back-emitting, two-dimensional Vertical Cavity Surface-Emitting Laser (VCSEL) arrays operating at 980 nm. The lasers are matched, via integrated microlenses, to corresponding monolithically-integrated photoreceiver arrays that are constructed in a InGaAs/InP Heterojunction Bipolar Transistor (HBT) technology. In initial breadboard-level tests, the photonic data channels built with these devices have been demonstrated with direct (3.3 V) CMOS drive of the VCSELs and a corresponding CMOS interface at the photoreceiver outputs. These links have shown electrical power consumption as low as 42 mW per channel for a 50% average duty cycle while operating at 100 Mb/s.
- Report Numbers
- E 1.99:sand--95-2797c
E 1.99: conf-9605101--4
conf-9605101--4
sand--95-2797c - Subject(s)
- Other Subject(s)
- Note
- Published through SciTech Connect.
03/01/1996.
"sand--95-2797c"
" conf-9605101--4"
"DE96006984"
IEEE electronic components and technology conference, Orlando, FL (United States), 28-31 May 1996.
Warren, M.E.; Carson, R.F.; Lear, K.L.; Lovejoy, M.L.; Kilcoyne, S.P., Craft, D.C.; Patrizi, G.A.; Seigal, P.K. - Funding Information
- AC04-94AL85000
View MARC record | catkey: 14109538