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Future technology challenges for failure analysis [electronic resource].

Published:
Washington, D.C. : United States. Dept. of Energy, 1995.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description:
6 pages : digital, PDF file
Additional Creators:
Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary:
Failure analysis is a critical element in the integrated circuit manufacturing industry. This paper explores the challenges for IC failure analysis in the environment of present and future silicon IC technology trends, using the 1994 National Technology Roadmap for Semiconductors as a technology guide. Advanced failure analysis techniques that meet the challenges of state-of-the-art IC technology are described and their applications are discussed. New paradigms will be required for failure analysis to keep pace with future advancements in IC technology.
Report Numbers:
E 1.99:sand--95-0624c
E 1.99: conf-951156--1
conf-951156--1
sand--95-0624c
Subject(s):
Other Subject(s):
Note:
Published through SciTech Connect.
08/01/1995.
"sand--95-0624c"
" conf-951156--1"
"DE95016411"
ISTFA `95: 21. international symposium for testing and failure analysis, Santa Clara, CA (United States), 5-10 Nov 1995.
Anderson, R.E.; Henderson, C.L.; Soden, J.M.
Funding Information:
AC04-94AL85000
View MARC record | catkey: 14110024