The effect of diamond scribe short removal on the mechanical integrity of alumina substrates [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 1997.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- 8 pages : digital, PDF file
- Additional Creators:
- United States. Department of Energy and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- The necessity to maintain the mechanical integrity of an alumina substrate during thick film processing has been documented. One of the consequences of diamond scribing sintered conductor material to remove shorts is the introduction of surface flaws in the alumina substrate. A small flaw can ultimately lead to substantial stress concentrations which result in reduced substrate strength. There is very little supporting performance data for this short removal process. How much is the flexure strength of a substrate degraded when filaments of conductor material are removed using a diamond scribe? An analysis was performed on a complex government application to determine how much a diamond scribe network had compromised the mechanical integrity of the substrate.
- Report Numbers:
- E 1.99:kcp--613-5934
E 1.99: conf-971028--
- Other Subject(s):
- Published through SciTech Connect.
30. international symposium on microelectronics, Philadelphia, PA (United States), 12-16 Oct 1997.
Tuohig, W.D.; Perdieu, L.H.
Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
- Funding Information:
View MARC record | catkey: 14110512