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Demonstration of a high heat removal CVD diamond substrate edge-cooled multichip module [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 1994.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
7 pages : digital, PDF file
Additional Creators
Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
A single substrate intended for a 3-dimensional (3D) edge-cooled multichip module (MCM) has been built and thermally tested. The substrate, with dimensions 1.9 in. by 2 in., is mounted in a fluid cooled block at one end. To test this cooling architecture and verify the accuracy of thermal models, the authors constructed thermal test modules using alumina (Al₂O₃), aluminum nitride (AlN), and CVD diamond substrate materials. Each module was populated with an array of 16 Sandia ATC03 test chips with resistive heaters and temperature sensing diode thermometers. Comparative measurements of the 3 substrates were made in which the top row of 4 die were heated at 5 W each for a total of 20 W. The maximum temperature differences between the heated die and the interface with the cold chuck, δT{sub js}, were 24, 126, and 265°C for diamond, AIN and alumina, respectively. Measurements on the diamond thermal test module, uniformly heated at a total power of 40 W, gave a measured junction-to-sink temperature of δT{sub js} = 18°C. This result indicates that the diamond edge-cooled substrate could dissipate a total power ∼200 W for a maximum δT{sub js} ∼100°C. If multiple substrates were mounted in the fluid cooled block, spaced 0.075 in. apart, the volumetric power density would be about 880 W/in.
Report Numbers
E 1.99:sand--93-2778c
E 1.99: conf-9404118--2
conf-9404118--2
sand--93-2778c
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
05/01/1994.
"sand--93-2778c"
" conf-9404118--2"
"DE94010748"
International Society for Hybrid multichip modules,Denver, CO (United States),13-15 Apr 1994.
Peterson, D.W.; Johnson, D.R.; Andaleon, D.D.; Renzi, R.F.; Sweet, J.N.
Funding Information
AC04-94AL85000
View MARC record | catkey: 14110604