Capillary flow on narrow strips and in V-shaped grooves [electronic resource].
- Published
- Washington, D.C. : United States. Dept. of Energy, 1995.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy. - Physical Description
- 21 pages : digital, PDF file
- Additional Creators
- Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
Access Online
- Restrictions on Access
- Free-to-read Unrestricted online access
- Summary
- Simple models for the flow of solder onto a copper metallized strip and into V-shaped groves in copper were derived and compared to experimental results. The conditions for initiation of flow are established and followed by the determination of flow rates for the two geometrical configurations. The analysis leads to the conclusion that the standard approach to capillary flow is adequate for describing these kinetics. A computer simulation using the interfacial energy minimization code Surface Evolver, is also used to examine these systems and it is shown that it does predict the experimentally observed morphologies. The two approaches are compared and similarities are discussed.
- Report Numbers
- E 1.99:sand--94-2215c
E 1.99: conf-950344--3
conf-950344--3
sand--94-2215c - Subject(s)
- Other Subject(s)
- Note
- Published through SciTech Connect.
12/31/1995.
"sand--94-2215c"
" conf-950344--3"
"DE95000543"
"GB0103012"
InterPack `95: international electronic packaging conference,Maui, HI (United States),26-30 Mar 1995.
Holm, E.A.; Yost, F.G. - Funding Information
- AC04-94AL85000
View MARC record | catkey: 14111443