Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuators [electronic resource].
- Published
- Washington, D.C. : United States. Dept. of Energy, 1995.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy. - Physical Description
- 10 pages : digital, PDF file
- Additional Creators
- Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
Access Online
- Restrictions on Access
- Free-to-read Unrestricted online access
- Summary
- The monolithic integration of micromechanical devices with their controlling electronics offers potential increases in performance as well as decreases in cost for these devices. Analog Devices has demonstrated the commercial viability of this integration by interleaving the micromechanical fabrication steps of an accelerometer with the microelectronic fabrication steps of its controlling electronics. Sandia`s Microelectronics Development Laboratory has integrated the micromechanical and microelectronic processing sequences in a segregated fashion. In this CMOS-first, micromechanics-last approach, conventional aluminum metallization is replaced by tungsten metallization to allow CMOS to withstand subsequent high-temperature processing during the micromechanical fabrication. This approach is a further development of an approach originally developed at UC Berkeley. Specifically, the issues of yield, repeatability, and uniformity of the tungsten/CMOS approach are addressed. Also, material issues related to the development of high-temperature diffusion barriers, adhesion layers, and low-stress films are discussed. Processing and material issues associated with alternative approaches to this integration such as micromechanics- first, CMOS-last or the interleaved process are also discussed.
- Report Numbers
- E 1.99:sand--95-0616c
E 1.99: conf-9510205--2
conf-9510205--2
sand--95-0616c - Subject(s)
- Other Subject(s)
- Note
- Published through SciTech Connect.
08/01/1995.
"sand--95-0616c"
" conf-9510205--2"
"DE95016722"
Micromachining and microfabrication process technology conference, Austin, TX (United States), 23-24 Oct 1995.
Smith, J.H.; Montague, S.; Sniegowski, J.J. - Funding Information
- AC04-94AL85000
View MARC record | catkey: 14113484