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Voltage-clearance recommendations for printed boards [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 1980.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
Pages: 25 : digital, PDF file
Additional Creators
Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
Present and future trends in printed board designs point to higher circuit densities with narrower lines and closer spacings. Some designers are now laying out boards with 0.13 mm lines and spacings. The reduction of nominal spacing between conductive elements has raised questions concerning the adequacy of present voltage-clearance recommendations. The present recommendations are considered too conservative in that they are weighted with large safety factors, especially for small clearances, and are frequently disregarded by many designers. Published voltage breakdown measurements made on printed boards with comb patterns with their enhanced conductor test lengths show breakdowns occurring at much higher voltages than those specified for the clearances in existing documents. A Task Group was set up to review published breakdown measurements and to make any additional measurements necessary to provide voltage-clearance recommendations. These recommendations are reported.
Report Numbers
E 1.99:sand-80-2065c
E 1.99: conf-800991-1
conf-800991-1
sand-80-2065c
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
01/01/1980.
"sand-80-2065c"
" conf-800991-1"
Fall 1980 IPC meeting, Chicago, IL, USA, 28 Sep 1980.
Evans, A; Cave, G; Smith, G A; Jennings, C W; Harrington, D J; Kirchenbaum, J; Martz, R E; Mierendorf, R C.
Funding Information
AC04-76DP00789
View MARC record | catkey: 14114189