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The effect of low Au concentrations on the properties of eutectic Sn/Pb [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 1992.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
81 pages : digital, PDF file
Additional Creators
Lawrence Berkeley National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
This study was of the effects moderately low Au concentrations (≤ 10 wt%) have on the mechanical properties and microstructure of an eutectic Sn/Pb alloy. Vibration (60--90 Hz swept sine wave for 30 hours) and thermal cycling (0--110C for 1450 cycles) reliability tests were performed on fine pitch leaded chip carriers using eutectic Sn/Pb solder on PCBs (printed circuit boards) with 0, 5, 10, 20, and 50μin nominal Au thicknesses. Testing was also performed on double shear creep specimens consisting of arrays of regular pitch joints. There was a dramatic increase in the number of joints containing voids with increasing Au concentration, an effect more pronounced in the creep joints than in the reliability joints. These voids tended to coalesce and grow during rework simulation of the reliability joints. AuSn₄ intermetallics present in toe of 4.8 wt% (50 μin) Au vibration joints rotated from initial vertical perpendicular to surface of PCB metallization, solidification positions to roughly horizontal (parallel to plating surface) orientations during rework simulation and during aging of the parts. The AuSn₄ intermetallics in the toe of the 4.8 wt% (50μin) Au reflowed joints also rotated after vibration testing. No joint failures were observed in either vibration tested or thermally cycled specimens. Cracks formed in some of the vibration tested specimen joints under the heel of the gull-wing lead at Pb-rich phases. Thermally cycled specimens showed eutectic microstructure and intermetallic coarsening without crack formation. Creep tests showed loss of the superplasticity in eutectic Sn/Pb alloys with even the lowest Au concentration tested of 0.2 wt% Au. Intermetallic rotation was not a factor in crack propagation, but void presence was. Cracks tended to form in joints containing voids before forming in void-free joints. Crack propagation followed Sn/Sn grain boundaries and Sn/Pb phase boundaries from Pb-rich phase to Pb-rich phase.
Report Numbers
E 1.99:lbl--32390
lbl--32390
Subject(s)
Other Subject(s)
Dissertation Note
Thesis (M.S.); PBD: May 1992
Note
Published through SciTech Connect.
05/01/1992.
"lbl--32390"
"DE92041206"
Kramer, P.A.
Funding Information
AC03-76SF00098
View MARC record | catkey: 14114718