Actions for Improved methods of fabricating multilayer printed wiring boards. Final report [electronic resource].

Email RIS file
Bookmark
Report an Issue

Improved methods of fabricating multilayer printed wiring boards. Final report [electronic resource].

Published
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1978.
Physical Description
Pages: 43 : digital, PDF file
Additional Creators
United States. Department of Energy. Office of Scientific and Technical Information
Access Online

Availability

I Want It
I Want It

Finding items...

Restrictions on Access
Free-to-read Unrestricted online access
Summary
A reliable process for the fabrication of multilayer printed wiring boards has been further improved by implementing a solder-dip-and-level process in place of the conventional pattern-tin-lead-plate process. A commercial chronic acid etchant has proven to be superior to the previously used sulfuric acid etchback solution. An economical, disposable polyvinyl-fluoride-film release sheet has been adopted, and a nuclear static-electricity eliminator has proven effective in providing lint-free panels.
Report Numbers
E 1.99:bdx-613-1657
bdx-613-1657
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
01/01/1978.
"bdx-613-1657"
Wilson, J.L.
Bendix Corp., Kansas City, Mo. (USA)
Funding Information
EY-76-C-04-0613
View MARC record | catkey: 14115380