Titanium/gold process characterization [electronic resource].
- Published
- Washington, D.C. : United States. Dept. of Energy, 1991.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy. - Physical Description
- Pages: (12 pages) : digital, PDF file
- Additional Creators
- United States. Department of Energy and United States. Department of Energy. Office of Scientific and Technical Information
Access Online
- Restrictions on Access
- Free-to-read Unrestricted online access
- Summary
- Characterization of the titanium/gold (Ti/Au) deposition process used at the Allied-Signal Inc., Albuquerque Microelectronics Operation (AMO) was performed. Tests were conducted to set up evaporation parameters, correlate titanium and gold thicknesses to sheet resistance, improve thickness uniformity, and reduce frontside contamination of deposit material on product wafers. The Ti/Au process is the final step in the production of integrated circuits (ICs) at the AMO wafer fabrication facility. 3 figs.
- Report Numbers
- E 1.99:kcp-613-4475
kcp-613-4475 - Subject(s)
- Other Subject(s)
- Note
- Published through SciTech Connect.
11/01/1991.
"kcp-613-4475"
"DE92002662"
Fajardo, L.S.
Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div. - Funding Information
- AC04-76DP00613
View MARC record | catkey: 14116238