Printed wiring board fabrication and lead elimination via single-bath electrodeposition [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 2001. and Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- PDF-FILE: 6 ; SIZE: 0.2 MBYTES pages
- Additional Creators:
- Lawrence Livermore National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- Printed wiring board (PWB) fabrication, an operation performed both at LLNL and throughout the electronics industry, generates considerable quantities of hazardous waste, notably lead-bearing materials used for soldering, tinning, and finish coating the circuits of the board. Hot-air solder leveling (HASL), the most common method of finishing is one of the main sources of hazardous lead-bearing wastes in traditional PWB manufacturing. The development of a safer finishing method will lead to employee health and environmental benefits. In addition, there is a production advantage to eliminating HASL, for it provides a fairly uneven surface that is problematic for mounting very small components. In this project, we developed ''single-bath electroplating'' as a potential HASL replacement technology for many applications. Single-bath electroplating involves alternating deposition of one or the other metal component of a bimetal bath, through control of plating potential and mass transport. It employs a nickel layer as both etch resist and finish coat and has the potential for lowering environmental and human-health risks associated with PWB manufacture--while at the same time reconfiguring the process for greater efficiency and profitability.
- Published through SciTech Connect., 02/21/2001., "ucrl-id-142542", and Meltzer, M P; Steffani, C P.
- Funding Information:
View MARC record | catkey: 14137539