Towards Next Generation TATB-based Explosives by Understanding Voids and Microstructure from 10 nm to 1 cm [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 2009. and Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- PDF-file: 14 pages; size: 2.5 Mbytes
- Additional Creators:
- Lawrence Berkeley National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- TATB-based explosives have been investigated on length scales spanning several orders of magnitude, from just under 10 nm to larger than 1 cm. This has been accomplished using a combination of ultra-small angle x-ray scattering (USAXS), ultra-small angle neutron scattering (USANS), and x-ray computed tomography (XRCT). USAXS determines distributions the smallest structures including hot-spot voids from hundreds of nanometers to a few microns, USANS extends this range to about 10 microns, and two variants of XRCT cover sizes from microns to centimeters. Several examples are presented for LX-17, a triaminotrinitrobenzene based plastic bonded explosive using Kel-F 800. As an extension of previous USAXS results, in these proceedings, an alternate binder results in a more uniform microstructure for the PBX, useful towards design of next-generation TATB-based explosives. These data are an important step to understanding microstructural mechanisms that affect the mechanical properties of TATB-based explosives, and provide complete a comprehensive characterization of the structure of LX-17 from nanometers to centimeters that can be used as empirical input to computational models of detonation, and in determining the relationship between voids and microstructure to detonation properties.
- Published through SciTech Connect., 03/26/2009., "llnl-proc-411719", Presented at: 40th International Annual Conference of ICT, Karlsruhe, Germany, Jun 23 - Jun 26, 2009., and Overturf, G; Willey, T M.
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