Actions for Microstructure evolution of tin under electromigration studied bysynchrotron X-Ray micro-diffraction [electronic resource].

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Microstructure evolution of tin under electromigration studied bysynchrotron X-Ray micro-diffraction [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 2005.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Additional Creators
United States. Department of Energy and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
Under constant current electromigration, white tin(?-Sn) exhibited a resistance drop of up to 10 percent. It has a body centertetragonal (BCT) structure, and the resistivity along the a and b axes is 35 percent smaller than that along the c axis. Microstructure evolution under electromigration could be responsible for the resistance drop. Synchrotron radiation white beam x-ray microdiffraction was used to study this evolution. Both stress and grain orientation was studied. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation during electromigration testing in ex-situ and in-situ samples. We observed that high resistance grainsreorient with respect to the neighboring low resistance grains, mostlikely by grain rotation of the latter. A different mechanism of microstructure evolution under electromigration from the normal grain growth is proposed and discussed.
Report Numbers
E 1.99:lbnl--59495
lbnl--59495
Other Subject(s)
Note
Published through SciTech Connect.
05/05/2005.
"lbnl--59495"
": KC0204016"
10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA,March 16-18,2005.
Tamura, N.; Lloyd, J.R.; Tu, K.-N.; Wu, Albert T.
Ernest Orlando Lawrence Berkeley National Laboratory, Berkeley, CA (US)
Funding Information
DE-AC02-05CH11231
A580ES
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