Reactive Spreading of a Lead-Free Solder on Alumina [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 2005. and Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Additional Creators:
- United States. Department of Energy and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- The wetting of Sn3Ag-based alloys on Al₂O₃ has been studied using the sessile-drop configuration. Small additions of Ti decrease the contact angle of Sn3Ag alloys on alumina from 115 to 23 degrees. Adsorption of Ti-species at the solid-liquid interface prior to reaction is the driving force for the observed decrease in contact angle, and the spreading kinetics is controlled by the kinetics of Ti dissolution into the molten alloy. The addition of Ti increases the transport rates at the solid-liquid interface, resulting in the formation of triple-line ridges that pin the liquid front and promote a wide variability in the final contact angles.
- Published through SciTech Connect., 12/01/2005., "lbnl--60618", ": KC0201020", Journal of Materials Research 21 12 ISSN 0884-2914; JMREEE FT, Tomsia, A.P.; Saiz, E.; Radmilovic, V.R.; Gremillard, L., and Ernest Orlando Lawrence Berkeley NationalLaboratory, Berkeley, CA (US)
- Funding Information:
- DE-AC02-05CH11231 and 512450
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