RF-Thermal-Structural Analysis of a Waveguide Higher Order Mode Absorber [electronic resource].
- Washington, D.C. : United States. Dept. of Energy. Office of Energy Research, 2007.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Additional Creators:
- Thomas Jefferson National Accelerator Facility (U.S.), United States. Department of Energy. Office of Energy Research, and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- For an ongoing high current cryomodule project, a total of 5 higher order mode (HOM) absorbers are required per cavity. The load is designed to absorb Radio Frequency (RF) heat induced by HOMs in a 748.5MHz cavity. Each load is targeted at a 4 kW dissipation capability. Water cooling is employed to remove the heat generated in ceramic tiles and by surface losses on the waveguide walls. A sequentially coupled RF-thermal-structural analysis was developed in ANSYS to optimize the HOM load design. Frequency-dependent dielectric material properties measured from samples and RF power spectrum calculated by the beam-cavity interaction codes were considered. The coupled field analysis capability of ANSYS avoided mapping of results between separate RF and thermal/structural simulation codes. For verification purposes, RF results obtained from ANSYS were compared to those from MAFIA, HFSS, and Microwave Studio. Good agreement was reached and this confirms that multiple-field coupled analysis is a desirable choice in analysis of HOM loads. Similar analysis could be performed on other particle accelerator components where distributed RF heating and surface current induced losses are inevitable.
- Report Numbers:
- E 1.99:jlab-ace-07-664
E 1.99: doe/or/23177-0081
- Other Subject(s):
- Published through SciTech Connect.
2007 IEEE Particle Accelerator Conference, Albuquerque, NM, 25-30 June 2007.
K. M. Wilson; H. Wang; R. A. Rimmer; M. Stirbet; G. Cheng; E. F. Daly; L. Vogel.
- Funding Information:
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