Practical limitations to indentation testing of thin films [electronic resource].

Published:: Washington, D.C. : United States. Dept. of Energy. Office of Energy Research, 1998.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description:: 5 pages : digital, PDF file
Additional Creators:: Sandia National Laboratories, United States. Department of Energy. Office of Energy Research, and United States. Department of Energy. Office of Scientific and Technical Information

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Summary:

A method that is becoming increasingly common for measuring the mechanical behavior of thin films is low-load indentation testing. However, there can be complications in interpreting the results as many factors can affect hardness and moduli measurements such as surface roughness and determination of the indentation contact area. To further the understanding, the mechanical properties of thin (50 nm) films of AlN on sapphire substrates were evaluated using a scanning force microscopy (SFM) based pico-indentation device to allow imaging of the surface and indentations. The primary emphasis was the types of problems or limitations involved in testing very thin, as deposited films in which properties are desired over indentation depths less than 50 nm.

Report Numbers:

E 1.99:sand--98-8459c
E 1.99: conf-971201--
conf-971201--
sand--98-8459c

Subject(s):

Materials Science

Other Subject(s):

Note:

Published through SciTech Connect.
11/01/1998.
"sand--98-8459c"
" conf-971201--"
"DE98052516"
1997 fall meeting of the Materials Research Society, Boston, MA (United States), 1-5 Dec 1997.
Schneider, J.A.; Moody, N.R.; McCarty, K.F.; Heffelfinger, J.R.

Funding Information:

AC04-94AL85000

View MARC record | catkey: 14449943