Actions for McCarter superfinish grinding for silicon -- an update [electronic resource].

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McCarter superfinish grinding for silicon -- an update [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 2000.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
12 pages : digital, PDF file
Additional Creators
Argonne National Laboratory, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
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Summary
A grinding technique, referred to as the McCarter Superfinish, for grinding large size optical components is discussed and certain surface characterization information about flatness and the relative magnitude of the subsurface damage in silicon substrates is reported. The flatness measurements were obtained with a Zygo surface analyzer, and the substrate damage measurements were made by x-ray diffraction and acid etching. Results indicate excellent control of flatness and fine surface finish. X-ray measurements show that the diamond wheels with small particle sizes used in the final phases of the grinding operation renders surfaces with relatively small subsurface damage.
Report Numbers
E 1.99:anl/upd/cp-103225
anl/upd/cp-103225
Subject(s)
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Note
Published through SciTech Connect.
11/03/2000.
"anl/upd/cp-103225"
SPIE 45th Annual Meeting, San Diego, CA (US), 07/30/2000--08/04/2000.
Khounsary, A.; Anthony, F.; Tangedahl, M.; McCarter, D.; Krasnicki, F.
Funding Information
W-31-109-ENG-38
View MARC record | catkey: 14450145