Investigation of Transferred-Arc Cleaning for Thin Film Removal [electronic resource].
- Washington, D.C : United States. Dept. of Energy. Office of the Assistant Secretary for Defense Programs, 1998.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- vp : digital, PDF file
- Additional Creators:
- Los Alamos National Laboratory, United States. Department of Energy. Office of the Assistant Secretary for Defense Programs, and United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- Transferred-arc cleaning is being investigated as a precision cleaning method for thin films on electrically conducting substrates as well as the traditional cleaning and roughening pretreatment for LPPS. Transferred-arc cleaning of copper substrates has been studied to identify the effect of processing conditions on cleaning and roughening characteristics. A Box-Behnken response surface design experiment varying the chamber pressure, substrate standoff distance, and torch current while observing the transferred arc voltage, voltage fluctuation, current, emitted light, and surface cleanliness was performed. The result of the analysis show the effect of the various independent variables on the measured responses. Distinct stages in the cleaning process are identified by their sample cleanliness, voltage level, voltage fluctuation, emitted light, and erosion rate.
- Report Numbers:
- E 1.99:la-ur-98-4509
- Published through SciTech Connect.
United Thermal Spray Conference, Dusseldorf (DE), 03/17/1998--03/19/1998.
Castro, R.G.; Hollis, K.; Bartram, B.
- Funding Information:
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