Actions for Yield strength and stress relaxation data for an adhesive used in butt joint tests [electronic resource].

Email RIS file
Bookmark
Report an Issue

Yield strength and stress relaxation data for an adhesive used in butt joint tests [electronic resource].

Published
Washington, D.C. : United States. Dept. of Energy, 1995.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
Physical Description
6 pages : digital, PDF file
Additional Creators
Sandia National Laboratories, United States. Department of Energy, and United States. Department of Energy. Office of Scientific and Technical Information
Access Online

Availability

I Want It
I Want It

Finding items...

Restrictions on Access
Free-to-read Unrestricted online access
Summary
Mechanical property data are reported for Epon 828/T403, an amine-cured epoxy adhesive. Data include compression modulus, compression yield strength and compression stress relaxation as a function of stress level, strain rate, and temperature and Mode I fracture toughness as a function of temperature. This data was generated to support a study investigating how temperature effects joint strength and the corresponding interface comer fracture toughness for adhesively bonded butt joints.
Report Numbers
E 1.99:sand--95-0869c
E 1.99: conf-951033--1
conf-951033--1
sand--95-0869c
Subject(s)
Other Subject(s)
Note
Published through SciTech Connect.
07/01/1995.
"sand--95-0869c"
" conf-951033--1"
"DE95013866"
27. international technical conference of the Society for the Advancement of Material and Process Engineering (SAMPE): diversity into the next century, Albuquerque, NM (United States), 9-12 Oct 1995.
Reedy, E.D. Jr.; Guess, T.R.
Funding Information
AC04-94AL85000
View MARC record | catkey: 14451905