Large scale molecular dynamics modeling of materials fabrication processes [electronic resource].
- Washington, D.C. : United States. Dept. of Energy, 1994.
Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy.
- Physical Description:
- 8 pages : digital, PDF file
- Additional Creators:
- Lawrence Livermore National Laboratory
United States. Department of Energy
United States. Department of Energy. Office of Scientific and Technical Information
- An atomistic molecular dynamics model of materials fabrication processes is presented. Several material removal processes are shown to be within the domain of this simulation method. Results are presented for orthogonal cutting of copper and silicon and for crack propagation in silica glass. Both copper and silicon show ductile behavior, but the atomistic mechanisms that allow this behavior are significantly different in the two cases. The copper chip remains crystalline while the silicon chip transforms into an amorphous state. The critical stress for crack propagation in silica glass was found to be in reasonable agreement with experiment and a novel stick-slip phenomenon was observed.
- Published through SciTech Connect.
1994 Society for Computer Simulation multiconference,San Diego, CA (United States),11-15 Apr 1994.
Stowers, I.F.; Belak, J.; Glosli, J.N.; Boercker, D.B.
- Funding Information:
View MARC record | catkey: 14455928