Low-temperature curing of a nitrile-epoxy adhesive. Final report [electronic resource].
- Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1981.
- Physical Description:
- Pages: 21 : digital, PDF file
- Additional Creators:
- United States. Department of Energy. Office of Scientific and Technical Information
- Restrictions on Access:
- Free-to-read Unrestricted online access
- Adhesive strength and glass transition temperature were correlated with cure times at 85/sup 0/C and above. The effect of moisture on adhesive cure and strength was tested. With a 3-hour cure at 85/sup 0/C, lap shear strength met specification requirements. The adhesive was found to absorb moisture with time, especially if one or both polyethylene covers are removed. Placing the adhesive in a desiccator for 30 minutes produced excellent room temperature shear strengths. Preconditioning (removal of moisture) is critical for elevated temperature cures.
- Published through SciTech Connect., 04/01/1981., "bdx-613-2553", Tira, J.S., and Bendix Corp., Kansas City, MO (USA)
- Funding Information:
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