Bond strength of urethane and epoxy-modified adhesives [electronic resource].
- Published
- Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1976.
- Physical Description
- Pages: 17 : digital, PDF file
- Additional Creators
- United States. Department of Energy. Office of Scientific and Technical Information
Access Online
- Restrictions on Access
- Free-to-read Unrestricted online access
- Summary
- A number of urethane and epoxy-modified urethane systems were evaluated as room-temperature-curing adhesives. The systems were formulated to yield a variety of modulus levels and to be compatible with certain chemically sensitive materials.
- Report Numbers
- E 1.99:y-2018
y-2018 - Subject(s)
- Other Subject(s)
- Note
- Published through SciTech Connect.
04/26/1976.
"y-2018"
Miller, C.E.; Childress, F.G.; Zava, A.K.
Oak Ridge Y-12 Plant, Tenn. (USA) - Funding Information
- W-7405-ENG-26
View MARC record | catkey: 14460855