Phase 2 of the automated array assembly task of the low cost silicon solar array project. Technical quarterly report No. 1, September 27--December 31, 1977. Motorola report No. 2345/1 [electronic resource].
- Oak Ridge, Tenn. : Distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 1977.
- Physical Description:
- Pages: 37 : digital, PDF file
- Additional Creators:
- United States. Department of Energy. Office of Scientific and Technical Information
- A process sequence for manufacturing silicon solar cell modules was chosen for detailed study. This sequence, when automated, is expected to be capable of mass producing modules combining high efficiency, low cost, high reliability, and minimal consumed materials and waste disposal. Specific steps are (1) plasma etch of silicon; (2) apply wax etch stop (one side); (3) texture etch; remove etch stop; (4) silicon nitride deposition (vacuum CVD); (5) form metallization pattern in Si/sub 3/N/sub 4/ (contact masked plasma etch); (6) ion implant back surface field region; (7) ion implant P-N junction; (8) thermal anneal of implant damage; (9) plate metal (front and back); solder coat; (10) test cells; interconnect; and (11) encapsulate. A wax which appears to display all the characteristics necessary for use as an etch stop has been selected and tested. Plasma etching of silicon, and contact-masked plasma etching of silicon nitride, have been shown to be feasible. Compatibility of simultaneous front and back plated metallization with this process sequence has been shown. Ion implantation studies have been delayed due to a longer-than-anticipated equipment installation time.
- Published through SciTech Connect.
Coleman, M.; Pryor, B.
Motorola, Inc., Phoenix, AZ (USA). Semiconductor Group
- Funding Information:
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