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- Unclassified, Unlimited, Publicly available.
- Different electroless plating systems were evaluated in conjunction with copper electroplating. All tests involved simultaneous deposition of front and back contacts using a standard cell materials. Cells with good adhesion and good curve fill factors were obtained using a palladium-chromium-copper metallization system. The final copper contact system was evaluated to determine if the copper would migrate at elevated temperatures. The copper migrated at elevated temperatures causing cell output degradation.
- Document ID: 19790023586.
Accession ID: 79N31757.
- No Copyright.
View MARC record | catkey: 15428117