Experimental Characterization and Simulation of Slip Transfer at Grain Boundaries and Microstructurally-Sensitive Crack Propagation

Author: Spear, Ashley
Published: November 13, 2013.
Physical Description: 1 electronic document
Additional Creators: Hochhalter, Jacob, Yamakov, Vesselin, Smith, Stephen, Glaessgen, Edward, Gupta, Vipul, and Scott, Willard

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Summary

A systematic study of crack tip interaction with grain boundaries is critical for improvement of multiscale modeling of microstructurally-sensitive fatigue crack propagation and for the computationally-assisted design of more durable materials. In this study, single, bi- and large-grain multi-crystal specimens of an aluminum-copper alloy are fabricated, characterized using electron backscattered diffraction (EBSD), and deformed under tensile loading and nano-indentation. 2D image correlation (IC) in an environmental scanning electron microscope (ESEM) is used to measure displacements near crack tips, grain boundaries and within grain interiors. The role of grain boundaries on slip transfer is examined using nano-indentation in combination with high-resolution EBSD. The use of detailed IC and EBSD-based experiments are discussed as they relate to crystal-plasticity finite element (CPFE) model calibration and validation.

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NASA Technical Reports Server (NTRS) Collection.

Note

Document ID: 20140005466.
NF1676L-16247.
National Symposium on Fatigue and Fracture Mechanics; 13-15 Nov. 2013; Jacksonville, FL; United States.
International ASTM/ESIS Symposium on Fatigue and Fracture Mechanics; 13-15 Nov. 2013; Jacksonville, Fl; United States.

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