Application of fracture mechanics in electronic packaging and materials : presented at the 1995 ASME International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, California / sponsored by the Electrical and Electronic Packaging Division, ASME [and] the Materials Division, ASME ; edited by Tien Y. Wu [and others].
- Conference Author:
- International Mechanical Engineering Congress and Exposition (1995 : San Francisco, Calif.)
- New York : American Society of Mechanical Engineers, 
- Copyright Date:
- Physical Description:
- vi, 271 pages : illustrations ; 28 cm.
- Additional Creators:
- Wu, Tien Y., American Society of Mechanical Engineers. Electrical and Electronic Packaging Division, and American Society of Mechanical Engineers. Materials Division
Full Text available online
By special arrangement in response to the COVID-19 pandemic, patrons may access this resource online through the HathiTrust Emergency Temporary Access Service.
View MARC record | catkey: 1551834