Flexible Microstrip Circuits for Superconducting Electronics
- Author:
- Mateo, Jennette
- Published:
- December 2013.
- Physical Description:
- 1 electronic document
- Additional Creators:
- Chervenak, James
Online Version
- hdl.handle.net , Connect to this object online.
- Restrictions on Access:
- Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access - Summary:
- Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (approximately 0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (approximately 0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving highquality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.
- Other Subject(s):
- Collection:
- NASA Technical Reports Server (NTRS) Collection.
- Note:
- Document ID: 20130014515.
GSC-16718-1.
NASA Tech Briefs, December 2013; 5-6. - Terms of Use and Reproduction:
- Copyright, Distribution as joint owner in the copyright.
View MARC record | catkey: 15631780