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Development of low cost custom hybrid microcircuit technology

Author
Perkins, K. L.
Published
Aug 1, 1981.
Physical Description
1 electronic document
Additional Creators
Licari, J. J.
Online Version

Availability

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Restrictions on Access
Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access
Summary
Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation.
Other Subject(s)
Collection
NASA Technical Reports Server (NTRS) Collection.
Note
Document ID: 19840019909.
Accession ID: 84N27978.
NASA-CR-161977.
NAS 1.26:161977.
Terms of Use and Reproduction
No Copyright.
View MARC record | catkey: 15707531