Low-temperature solder for joining large cryogenic structures
- Author
- Buckley, J. D.
- Published
- Sep 1, 1980.
- Physical Description
- 1 electronic document
- Additional Creators
- Sandefur, P. G., Jr.
Online Version
- hdl.handle.net , Connect to this object online.
- Restrictions on Access
- Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access - Summary
- Three joining methods were considered for use in fabricating cooling coils for the National Transonic Facility. After analysis and preliminary testing, soldering was chosen as the cooling coil joining technique over mechanical force fit and brazing techniques. Charpy V-Notch tests, cyclic thermal tests (ambient to 77.8 K) and tensile tests at cryogenic temperatures were performed on solder joints to evaluate their structural integrity. It was determined that low temperature solder can be used to ensure good fin-to-tube contact for cooling-coil applications.
- Other Subject(s)
- Collection
- NASA Technical Reports Server (NTRS) Collection.
- Note
- Document ID: 19800023982.
Accession ID: 80N32490.
L-13712.
NASA-TM-81836. - Terms of Use and Reproduction
- No Copyright.
View MARC record | catkey: 15721236