Email RIS file
Bookmark
Report an Issue

Design guidelines for advanced LSI microcircuit packaging using thick film multilayer technology

Author:
Peckinpaugh, C. J.
Published:
May 1, 1974.
Physical Description:
1 electronic document
Online Version

Availability

I Want It
I Want It

Finding items...

Restrictions on Access:
Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access
Summary:
Ceramic multilayer circuitry results from the sequential build-up of two or more layers of pre-determined conductive interconnections separated by dielectric layers and fired at an elevated temperature to form a solidly fused structure. The resultant ceramic interconnect matrix is used as a base to mount active and passive devices and provide the necessary electrical interconnection to accomplish the desired electrical circuit. Many methods are known for developing multilevel conductor mechanisms such as multilayer printed circuits, welded wire matrices, flexible copper tape conductors, and thin and thick-film ceramic multilayers. Each method can be considered as a specialized field with each possessing its own particular set of benefits and problems. This design guide restricts itself to the art of design, fabrication and assembly of ceramic multilayer circuitry and the reliability of the end product.
Other Subject(s):
Collection:
NASA Technical Reports Server (NTRS) Collection.
Note:
Document ID: 19750010413.
Accession ID: 75N18485.
NASA-CR-120619.
Terms of Use and Reproduction:
No Copyright.
View MARC record | catkey: 15740829