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Adhesion of gold to various planes of copper studied with LEED

Author
Buckley, D. H.
Published
Jun 1, 1969.
Physical Description
1 electronic document
Online Version

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Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access
Summary
Adhesion of gold on copper planes studied with low energy electron diffraction
Other Subject(s)
Collection
NASA Technical Reports Server (NTRS) Collection.
Note
Document ID: 19690020029.
Accession ID: 69N29407.
NASA-TN-D-5290.
Terms of Use and Reproduction
No Copyright.
View MARC record | catkey: 15953464