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Computational Aerothermodynamic Assessment of Space Shuttle Orbiter Tile Damage : Open Cavities

Author:
Wood, William
Published:
[2005].
Physical Description:
1 electronic document
Additional Creators:
Pulsonetti, Maria
Online Version

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Summary:
Computational aerothermodynamic simulations of Orbiter windside tile damage in flight were performed in support of the Space Shuttle Return-to-Flight effort. The simulations were performed for both hypervelocity flight and low-enthalpy wind tunnel conditions and contributed to the Return-to-Flight program by providing information to support a variety of damage scenario analyses. Computations at flight conditions were performed at or very near the peak heating trajectory point for multiple damage scenarios involving damage windside acreage reaction cured glass (RCG) coated silica tile(s). The cavities formed by the missing tile examined in this study were relatively short leading to flow features which indicated open cavity behavior. Results of the computations indicated elevated heating bump factor levels predicted for flight over the predictions for wind tunnel conditions. The peak heating bump factors, defined as the local heating to a reference value upstream of the cavity, on the cavity floor for flight simulation were 67% larger than the peak wind tunnel simulation value. On the downstream face of the cavity the flight simulation values were 60% larger than the wind tunnel simulation values. On the outer mold line (OML) downstream of the cavity, the flight values are about 20% larger than the wind tunnel simulation values. The higher heating bump factors observed in the flight simulations were due to the larger driving potential in terms of energy entering the cavity for the flight simulations. This is evidenced by the larger rate of increase in the total enthalpy through the boundary layer prior to the cavity for the flight simulation.
Other Subject(s):
Collection:
NASA Technical Reports Server (NTRS) Collection.
Note:
Document ID: 20050192429.
AIAA Paper 2005-4679.
38th AIAA Thermophysics Conference; 6-9 Jun. 2005; Toronto, Ontario; Canada.
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