Email RIS file
Bookmark
Report an Issue

Modified Process Reduces Porosity when Soldering in Reduced Gravity Environments

Author
Watson, Kevin
Published
February 2012.
Physical Description
1 electronic document
Additional Creators
Pettegrew, Richard, Haylett, Daniel, Struk, Peter, and Downs, Robert
Online Version

Availability

I Want It
I Want It

Finding items...

Restrictions on Access
Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access
Summary
A modified process yields lower levels of internal porosity for solder joints produced in reduced-gravity environments. The process incorporates both alternative materials and a modified procedure. The process provides the necessary cleaning action to enable effective bonding of the applied solder alloy with the materials to be joined. The modified process incorporates a commercially available liquid flux that is applied to the solder joint before heating with the soldering iron. It is subsequently heated with the soldering iron to activate the cleaning action of the flux and to evaporate most of the flux, followed by application of solder alloy in the form of commercially available solid solder wire (containing no flux). Continued heating ensures adequate flow of the solder alloy around and onto the materials to be joined. The final step is withdrawal of the soldering iron to allow alloy solidification and cooling of the solder joint.
Other Subject(s)
Collection
NASA Technical Reports Server (NTRS) Collection.
Note
Document ID: 20120007493.
MSC-24023-1.
NASA Tech Briefs, February 2012; 14.
Terms of Use and Reproduction
Copyright, Distribution as joint owner in the copyright.
View MARC record | catkey: 16008503