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Copper-titanium eutectic alloy improves electrical and mechanical contact to silicon carbide

Author:
Shier, J. S.
Published:
Nov 1, 1970.
Physical Description:
1 electronic document

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Restrictions on Access:
Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access
Summary:
Contact preparation at low temperatures is possible with the use of a copper-titanium eutectic alloy. Contacts formed with this alloy are ohmic on p-type silicon carbide and rectifying on n-type.
Collection:
NASA Technical Reports Server (NTRS) Collection.
Note:
Document ID: 19700000428.
Accession ID: 70B10444.
ERC-10256.
Terms of Use and Reproduction:
No Copyright.
Online Version:
hdl.handle.net
View MARC record | catkey: 16208483