Copper-titanium eutectic alloy improves electrical and mechanical contact to silicon carbide

Author:: Shier, J. S.
Published:: Nov 1, 1970.
Physical Description:: 1 electronic document

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Summary:

Contact preparation at low temperatures is possible with the use of a copper-titanium eutectic alloy. Contacts formed with this alloy are ohmic on p-type silicon carbide and rectifying on n-type.

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MATERIALS

Collection:

NASA Technical Reports Server (NTRS) Collection.

Note:

Document ID: 19700000428.
Accession ID: 70B10444.
ERC-10256.

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