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Fluorine-Based DRIE of Fused Silica

Author
Yee, Karl
Published
September 2007.
Physical Description
1 electronic document
Additional Creators
Li, Jian, Shcheglov, Kirill, and Choi, Daniel
Online Version

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Unclassified, Unlimited, Publicly available.
Free-to-read Unrestricted online access
Summary
A process of deep reactive-ion etching (DRIE) using a fluorine-based gas mixture enhanced by induction-coupled plasma (ICP) has been demonstrated to be effective in forming high-aspect-ratio three-dimensional patterns in fused silica. The patterns are defined in part by an etch mask in the form of a thick, high-quality aluminum film. The process was developed to satisfy a need to fabricate high-aspect-ratio fused-silica resonators for vibratory microgyroscopes, and could be used to satisfy similar requirements for fabricating other fused-silica components.
Other Subject(s)
Collection
NASA Technical Reports Server (NTRS) Collection.
Note
Document ID: 20100010945.
NPO-43837.
NASA Tech Briefs, September 2007; 31.
Terms of Use and Reproduction
Copyright, Distribution as joint owner in the copyright.
View MARC record | catkey: 16411190