Transmit receive modules for radar and communication systems / Rick Sturdivant, Mike Harris
- Author:
- Sturdivant, Rick
- Published:
- Boston : Artech House, [2016]
- Physical Description:
- xix, 240 pages : illustrations ; 24 cm.
- Additional Creators:
- Harris, Mike
- Series:
- Contents:
- Machine generated contents note: 1.1.Phased Arrays in Radar and Communication Systems -- 1.2.Antennas -- 1.3.Antenna Patterns and Line Arrays -- 1.4.Electronically Steerable Antennas -- 1.5.Radar Equation for Targets -- 1.6.Radar Equation for Weather -- 1.7.Phased Arrays for Communication Systems -- 1.8.Conclusions -- Problems -- References -- 2.1.Introduction to Transmit/Receive Modules -- 2.2.Early T/R Module Development Efforts -- 2.3.MMIC-Based T/R Modules -- 2.4.T/R Module Performance Requirements -- 2.5.T/R Module Components -- 2.5.1.Transmit/Receive Switches -- 2.5.2.Phase Shifter -- 2.5.3.Attenuators -- 2.5.4.Core Chip -- 2.5.5.Driver Amplifier -- 2.5.6.Power Amplifier -- 2.5.7.Circulator or Duplexer -- 2.5.8.Limiter or Receive Protect Circuit -- 2.5.9.Low-Noise Amplifier -- 2.6.Module Control and Power Conditioning -- 2.7.Conclusions -- Problems -- References -- 3.1.Introduction -- 3.2.Semiconductor Materials -- 3.2.1.GaAs -- 3.2.2.Heterostructures -- 3.2.3.SiC -- 3.2.4.GaN -- 3.2.5.InP -- 3.2.6.SiGe -- 3.3.RF Semiconductor Wafer Fabrication Processes -- 3.3.1.Isolation -- 3.3.2.Ohmic Contacts -- 3.3.3.Gate Formation -- 3.3.4.Dielectric Deposition -- 3.3.5.Electroplating -- 3.3.6.Air Bridges -- 3.4.Active Devices -- 3.4.1.GaAs MESFETs -- 3.4.2.GaAs PHEMTs -- 3.4.3.GaN HEMTs -- 3.5.MMICs -- 3.6.Conclusions -- Problems -- References -- 4.1.Introduction to Signal Integrity -- 4.2.Chip-Level Interconnects -- 4.2.1.Wire Bonding Methods -- 4.2.2.Wire Bond Modeling -- 4.2.3.Flip-Chip Methods -- 4.3.Package/Module-Level Interconnect -- 4.3.1.Module Interconnects -- 4.3.2.SMT Package Interconnects -- 4.4.Transmission Line Interconnects -- 4.5.Coupling Between Interconnects -- 4.6.Vertical Transition Interconnects -- 4.7.Module Resonances -- 4.8.Conclusions -- Problems -- References -- 5.1.Introduction to Materials -- 5.2.Electrical Parameters and Their Measurement -- 5.2.1.Dielectric Constant -- 5.2.2.Loss Tangent -- 5.2.3.Measurement of Dielectric Constant and Loss Tangent -- 5.2.4.Metal Electrical Conductivity -- 5.3.Mechanical Parameters -- 5.3.1.Thermal Conductivity -- 5.4.Ceramic Materials -- 5.4.1.Thin-Film Ceramic -- 5.4.2.Thick-Film Ceramic -- 5.4.3.Thermally Enhanced Thick-Film Processes -- 5.4.4.High-Temperature Co-Fired Ceramic (HTCC) -- 5.4.5.Low-Temperature Co-Fired Ceramic (LTCC) Materials -- 5.5.Laminate Packaging -- 5.5.1.Laminate Board Fabrication -- 5.5.2.High-Performance Laminate Materials -- 5.5.3.Liquid Crystal Polymers -- 5.5.4.MCM-L Laminate Multichip Modules -- 5.6.Conclusions -- Problems -- References -- 6.1.Introduction to Thermal Issues and Solutions -- 6.2.Heat Flux in MMIC High-Power Amplifiers -- 6.3.Amplifier Efficiency and Dissipated Thermal Power -- 6.4.Thermal Resistance and Device Junction Temperature -- 6.5.Example of Heat Dissipated by Components in a T/R Module -- 6.6.Reliability Calculations -- 6.7.Diamond-Enhanced GaN High-Power Amplifiers for T/R Modules -- 6.8.Thermal Simulations Using SPICE -- 6.9.Thermal Measurements -- 6.9.1.Electrical Test Methods -- 6.9.2.Optical Methods -- 6.9.3.Temperature Measurements Using Liquid Crystal Thermography -- 6.9.4.Thermal Design Using Surrogate Validation Chips -- 6.10.Conclusions -- Problems -- References -- 7.1.Introduction -- 7.2.MMIC Fabrication -- 7.2.1.MMIC Facilities -- 7.2.2.MMIC Fabrication Processes -- 7.2.3.MMIC Foundry Procedures -- 7.3.T/R Module Manufacturing -- 7.3.1.T/R Module Manufacturing Facilities -- 7.3.2.T/R Module Manufacturing Processes -- 7.4.Conclusions -- Problems -- References -- 8.1.Introduction to Testing -- 8.2.MMIC Testing -- 8.2.1.Incoming Materials Testing -- 8.2.2.In-Process Testing -- 8.2.3.On-Wafer RF Testing -- 8.2.4.MMIC Screening Tests -- 8.2.5.MMIC Reliability Testing -- 8.3.T/R Module Specifications -- 8.4.T/R Module Testing -- 8.4.1.Key Electrical Parameters -- 8.4.2.Example of Key Parameter Requirements on an X-Band T/R Module -- 8.4.3.Automated Electrical Test Set -- 8.5.Conclusions -- Problems -- References -- 9.1.Introduction -- 9.2.MMIC Cost -- 9.2.1.MMIC Wafer Fabrication Cost -- 9.2.2.Wafer Fabrication Process Yield -- 9.2.3.Wafer Diameter Impact on MMIC Cost -- 9.2.4.Impact of MMIC Fabrication Facility Loading on Cost -- 9.2.5.MMIC Cost Based on Area or Output Power -- 9.3.T/R Module Cost -- 9.4.Cost Reduction -- 9.4.1.MMIC Cost Reduction -- 9.4.2.T/R Module Cost Reduction -- 9.5.Conclusions -- Problems -- References -- 10.1.Introduction -- 10.2.Single-Chip T/R Module -- 10.3.Wafer-Scale Phased Array -- 10.4.Si-CMOS: The Lowest-Cost Single-Chip T/R -- 10.5.Digital Beamforming -- 10.6.Hybrid Digital/Analog Beam Forming -- 10.7.Switch Beam and Butler Matrix Phased Arrays -- 10.8.Highly Integrated Packaging of T/R Modules -- 10.9.Path to Low-Cost Systems: Open Architectures -- 10.10.Conclusions -- Problems -- References.
- Subject(s):
- ISBN:
- 1608079791
9781608079797 - Bibliography Note:
- Includes bibliographical references and index.
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