Characterization of integrated circuit packaging materials / editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick
- Published:
- Boston : Butterworth-Heinemann, [1993]
- Copyright Date:
- ©1993
- Physical Description:
- 1 online resource (xviii, 274 pages) : illustrations
- Additional Creators:
- Moore, Thomas M. and McKenna, Robert G.
Access Online
- Series:
- Summary:
- Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
- Subject(s):
- Other Subject(s):
- ISBN:
- 9781483292342 (electronic bk.)
1483292347 (electronic bk.)
0750692677
9780750692670 - Bibliography Note:
- Includes bibliographical references and index.
View MARC record | catkey: 18157275