Design & reliability of solders and solder interconnections : proceedings of a symposium held during the TMS Annual Meeting at Orlando, Florida, February 10-13, 1997 / edited by Rao K. Mahidhara [and others] ; sponsors, ASM-MSD Flow and Fracture Committee, TMS-SMD Mechanical Metallurgy Committee, TMS-EMPMD Electronic, Magnetic, Photonic Materials Committee

Published:: Warrendale, Pa. : Minerals, Metals & Materials Society, [1997]
Copyright Date:: ©1997
Physical Description:: xi, 448 pages : illustrations ; 28 cm
Additional Creators:: Mahidhara, Rao K., Minerals, Metals and Materials Society. Annual Meeting (126th : 1997 : Orlando, Fla.), American Society for Metals. Flow and Fracture Committee, Minerals, Metals and Materials Society. Mechanical Metallurgy Committee, and Minerals, Metals and Materials Society. Electronic, Magnetic, Photonic Materials Committee

Browse Nearby on Shelf

Finding items...

Subject(s):

ISBN:

0873393546

Bibliography Note:

Includes bibliographical references and index.

Action Note:

committed to retain 20170930 20430101 HathiTrust https://www.hathitrust.org/shared_print_program

View MARC record | catkey: 1937647